Semiconductor Packaging News2m
It’s All About Edge AI, But Where’s the Revenue?
Summary At Embedded World North America, Counterpoint’s Mohit Agrawal emphasized AI's edge growth, predicting a 31× rise in NPU-enabled cellular IoT modules by 2030. He highlighted key trends in AI ...
Semiconductor Packaging News2m
US weighs AI chip export caps: sources
US officials are discussing capping AI chip sales by Nvidia and other American companies to specific countries, focusing on national security concerns. This move targets AI development in Persian Gulf ...
Semiconductor Packaging News4m
Do scientists need the tech industry to sustain AI?
Summary AI pioneer Geoffrey Hinton, after winning the Nobel Prize in Physics, celebrated at Google's headquarters, reflecting A ...
Semiconductor Packaging News8m
ASML share plunge wipes over $50 billion off Dutch chip giant’s value
ASML share plunge wipes over $50 billion off Dutch chip giant’s value: Summary ASML shares plunged 16% after releasing disappointing sales forecasts, wiping out €48.7 billion ...
Semiconductor Packaging News13m
Chip Industry Awareness Brings Prospect of More Regulation on Several Fronts
Chip Industry Awareness Brings Prospect of More Regulation on Several Fronts: Summary Silicon Labs CTO Daniel Cooley discussed the evolving chip industry at embedded world North A ...
Semiconductor Packaging News19m
Advancements In Silicon Device Technology And Design Driving New SLM Monitor Categories
Silicon technology continues evolving to overcome its limitations, as innovations like gate-all-around (GAA) transistors and heterogeneous integration enhance performance. Advances in lithography and ...
Semiconductor Packaging News17m
The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing
To High-Volume Manufacturing: Summary The semiconductor industry is embracing glass substrates, replacing organic ones, to meet t ...
Semiconductor Packaging News23m
Urgent support needed to protect Korea’s chip leadership
Summary South Korea must urgently boost support to maintain its semiconductor dominance, according to former industry ministers. At a recent conference, they urged Samsung to overhaul its corporate ...
Semiconductor Packaging News22m
New Challenges In IC Reliability
Experts from Synopsys, proteanTecs, Siemens EDA, and Ansys discussed the evolving reliability of semiconductor chips. They highlighted emerging challenges in verification and performance, emphasizing ...
Semiconductor Packaging News22m
Metrology Advances Step Up To Sub-2nm Device Node Needs
Summary Metrology and inspection face new challenges as semiconductor features shrink to 2nm and below. Suppliers must innovate ahead of demand, while fabs integrate advanced analytics for precision.
Semiconductor Packaging News18h
Samsung reportedly lowers HBM production target by 10%; reassigns R&D personnel to boost competitiveness
Samsung reportedly lowers HBM production target by 10%; reassigns R&D personnel to boost competitiveness: Summary Samsung Electronics faces delays in high bandwidth memory (HBM) s ...
Semiconductor Packaging News18h
Worldwide Smartphone Market Grows 4% with 316.1 Million Units Shipped in the Third Quarter of 2024, According to IDC
Worldwide Smartphone Market Grows 4% with 316.1 Million Units Shipped in the Third Quarter of 2024, According to IDC: Summary Global smartphone shipments surged 4% in Q3 2024, con ...